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Sepheo sa Tantalum Sputtering - Disc

Tlhaloso e Khutšoanyane:

Sepheo sa Tantalum sputtering se sebelisoa haholo indastering ea semiconductor le indastering ea ho roala optical.Re etsa litlhaloso tse fapaneng tsa sepheo sa tantalum sputtering ka kopo ea bareki ho tsoa indastering ea semiconductor le indasteri ea optical ka mokhoa oa ho qhibilihisa oa EB oa vacuum.Ka ho ela hloko ts'ebetso e ikhethang ea ho roala, ka kalafo e rarahaneng le mocheso o nepahetseng oa nako le nako, re hlahisa litekanyo tse fapaneng tsa sepheo sa tantalum sputtering joalo ka disc targets, target targets le rotary targets.Ho feta moo, re netefatsa hore bohloeki ba tantalum bo pakeng tsa 99.95% le 99.99% kapa ho feta;boholo ba lijo-thollo bo ka tlase ho 100um, ho bata ho ka tlase ho 0.2mm le Bokaholimo


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Tlhaloso

Sepheo sa Tantalum sputtering se sebelisoa haholo indastering ea semiconductor le indastering ea ho roala optical.Re etsa litlhaloso tse fapaneng tsa sepheo sa tantalum sputtering ka kopo ea bareki ho tsoa indastering ea semiconductor le indasteri ea optical ka mokhoa oa ho qhibilihisa oa EB oa vacuum.Ka ho ela hloko ts'ebetso e ikhethang ea ho roala, ka kalafo e rarahaneng le mocheso o nepahetseng oa nako le nako, re hlahisa litekanyo tse fapaneng tsa sepheo sa tantalum sputtering joalo ka disc targets, target targets le rotary targets.Ho feta moo, re netefatsa hore bohloeki ba tantalum bo pakeng tsa 99.95% le 99.99% kapa ho feta;boholo ba lijo-thollo bo ka tlase ho 100um, ho bata ho ka tlase ho 0.2mm le Surface Roughness e ka tlase ho Ra.1.6μm.Boholo bo ka ikamahanya le litlhoko tsa bareki.Re laola boleng ba lihlahisoa tsa rona ka mohloli oa lihlahisoa tse tala ho fihlela mohala oohle oa tlhahiso 'me qetellong re li isa ho bareki ba rona e le ho etsa bonnete ba hore u reka lihlahisoa tsa rona ka boleng bo tsitsitseng le bo tšoanang ka lotho.

Re leka ka hohle ho qapa mekhoa ea rona, ho ntlafatsa boleng ba sehlahisoa, ho eketsa sekhahla sa tšebeliso ea sehlahisoa, ho theola litšenyehelo, ho ntlafatsa litšebeletso tsa rona ho fa bareki ba rona lihlahisoa tsa boleng bo holimo empa litšenyehelo tse tlase tsa theko.Ha u se u re khethile, u tla fumana lihlahisoa tsa rona tse tsitsitseng tsa boleng bo holimo, theko ea tlholisano ho feta barekisi ba bang le lits'ebeletso tsa rona tse nakong, tse sebetsang hantle haholo.

Re hlahisa lipehelo tsa R05200, R05400 tse fihlelang maemo a ASTM B708 ​​mme re ka etsa lipehelo ho latela litšoantšo tse fanoeng.Re nka melemo ea li-ingots tsa rona tsa boleng bo holimo tsa tantalum, lisebelisoa tse tsoetseng pele, theknoloji e ncha, sehlopha sa litsebi, re lokiselitse lipheo tsa hau tse hlokahalang tsa sputtering.U ka re bolella litlhoko tsohle tsa hau mme re inehetse ho etsa tlhahiso ho latela litlhoko tsa hau.

Mofuta le boholo:

ASTM B708 ​​Standard Tantalum Sputtering Target , 99.95% 3N5 - 99.99% 4N Purity , Disc Target

Mefuta ea Lik'hemik'hale:

Tlhahlobo e Tloaelehileng:Ta 99.95% 3N5 - 99.99%(4N)

Metallic litšila, ppm max ka boima ba 'mele

Element Al Au Ag Bi B Ca Cl Cd Co Cr Cu Fe
Litaba 0.2 1.0 1.0 1.0 0.1 0.1 1.0 1.0 0.05 0.25 0.75 0.4
Element Ga Ge Hf K Li Mg Na Mo Mn Nb Ni P
Litaba 1.0 1.0 1.0 0.05 0.1 0.1 0.1 5.0 0.1 75 0.25 1.0
Element Pb S Si Sn Th Ti V W Zn Zr Y U
Litaba 1.0 0.2 0.2 0.1 0.0 1.0 0.2 70.0 1.0 0.2 1.0 0.005

Litšila tsa Non-Metallic, ppm max ka boima ba 'mele

Element N H O C
Litaba 100 15 150 100

Tekanyo: Tantalum

Boholo ba lijo-thollo: Boholo bo tloaelehileng <100μm Bongata ba lijo-thollo

Mefuta e meng ea lijo-thollo e fumaneha ka kopo

Bophahamo: ≤0.2mm

Bokhopo ba Bokahohle:< Ra 1.6μm

Bokaholimo: E hloekisitsoe

Lisebelisoa

Lisebelisoa tsa ho roala bakeng sa semiconductors, optics


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